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2/4层载板

层结构(Layer Structure):	2/4层
最小线宽线距(Min line width/spacing):	40um/40um
最小孔径(Min Via diameter):	0.1mm
成品板厚(Finish thickness):	0.15-0.35mm
表面处理(Surface finish):	Soft/Hard gold
技术亮点(Technical highlights)	Resin fill hole
产品应用(Applications):	存储