技术能力

HDI板

Item 2018 2019 2020
SBU Configuration 14L Anylayer(ELIC) 16L Anylayer(ELIC) 18L Anylayer(ELIC)
Stack via Available Available Available
Min Line Width/Spacing 40μm/50μm 30μm/40μm 30μm/30μm
Laser Direct Image Available Available Available
Min Laster Drill Diameter/pad size 100μm/220μm 100μm/220μm 75μm/150μm
Microvia copper filling Available Available Available
Copper Filling Dimple Size 25μm 20μm 15μm
Min Laser Dielectric Thickness 35μm 30μm 25μm
Min core thickness 50μm 50μm 50μm
Max Laser Via Aspect Ratio 0.7:1 0.8:1 1:1
Min BGA Pitch 350μm 300μm 250μm
Solder mask Registration tolerance ±40μm ±35μm ±25μm
Impedance Control Tolerance ±10% ±8% ±7%
Warpage 0.70% 0.50% 0.30%

高多层板

Item 2018 2019 2020
Max Layer Count 48L 50L 50L
Min Line Width/Spacing 50μm/50μm 40μm/40μm 30μm/30μm
Heavy Copper 30Z 40Z 60Z
Back Drill Available Available Available
Microvia copper filling Available Available Available
Copper Filling Dimple Size 25μm 20μm 15μm
Embedded devices Available Available Available
Press fit Copper Coin Available Available Available
Max Finished Board Thickness 7mm 8mm 10mm
Max Via Aspect Ratio 20:1 25:1 30:1
Solder mask Registration tolerance ±40μm ±35μm ±25μm
Impedance Control Tolerance ±10% ±8% ±7%
Warpage 0.70% 0.50% 0.30%

通信模块板

Item 2018 2019 2020
SBU Configuration 3+N+3 4+N+4 Anylayer(ELIC)
Stack Via Available Available Available
Min Line Width/Spacing 40μm/50μm 30μm/40μm 30μm/30μm
Laser Direct Image Available Available Available
Min Laser Drill Diameter/pad size 100μm/220μm 100μm/200μm 75μm/150μm
Microvia Copper Filling Available Available Available
Copper Filling Dimple Size 25μm 20μm 15μm
Min Core Thickness 50μm 50μm 50μm
Min Hole Size For PTH Half Hole 0.4mm 0.4mm 0.4mm
Max Laser Via Aspect Ratio 0.7:1 0.8:1 1:1
Hard Gold Thickness For Gold Finger 15-30U“ 30-50U“ 50U“
Solder mask Registration tolerance ±40μm ±35μm ±25μm
Impedance Control Tolerance ±10% ±8% ±7%
Warpage 0.70% 0.50% 0.30%

载板

Core Materials HL832NXA、HL832NS HL832NSR(LC)
DS-7409HGB/(S) DS-7409HGB(LE) DS-7409HGB(X)
R1515E/R1515H R1515E/R1515H /
SI643HU SI10U SI09U,SI07U,SI05U
Board Tks Core/PP 2L,100/40 2L,100/40 2L,80/30
/ 3L,120/25 3L,110/25 3L,90/25
4L,180/50/25 4L,170/40/25 4L,150/30/20
6L,250/50/25 6L,230/40/25 6L,210/30/20
Process Tenting MSAP / /
Line/Space 45/45 40/40 30/30 25/25
Finger Pitch 100 90 80 70 65
BGA Pitch 400 400 300 300
Mech.Hole/Land 100/200 100/250 75/200 75/200
Blind.Hole/Land 65/150 65/135 60/120 50/110
TCF Dia/Deepth 100/200 100/250 75/200 75/200
Solder Resist EG23A,AUS308,AUS320,AUS410 SR1,SR2,SR3
SR Reg±30 SR Reg±20 SR Reg±15
Flatness:8max Flatness:5max Flatness:3max
Surface Finish Soft Gold/Hard Gold/ENEPIG,OSP Soft Gold/Hard Gold/ENEPIG,OSP

软板和软硬结合板

Items 2018 2019 2020
Structure
(Layer Count)		 FPC
 8
 10
 12
Rigid-Flex 8-4-8 10-4-10 12-4-12
Fine Pattern
(Line/Space)		 Inner Available Available Available
Outer(with plating) 40μm/50μm 30μm/40μm 30μm/30μm
Wire Bonding Pad Available Available Available
Via Size MVH(Via/Land) 80/280μm 70/250μm 50/200μm
PTH(Via/Land) 100/300μm 80/260μm 60/220μm
Registration Photo Solder Resist ±40μm ±35μm ±30μm
Cover-lay ±75μm ±50μm ±50μm
Marking ±125μm ±100μm ±100μm
Stiffener(SUS) ±100μm ±90μm ±80μm
DAM Photo Solder Resist 80μm 70μm 60μm
Cover-lay 200μm 175μm 150μm
Impedance Control ±10% ±8% ±6%
Via Filling Cu fill Cu fill Cu fill
Surface Finish 0.70% 0.50% 0.30%