| 层结构(Layer Structure): | 10层2+6+2 HDI |
| 最小线宽线距(Min line width/spacing): | 50um/50um |
| 最小孔径(Min Via diameter): | 0.1mm激光孔/0.2mm机械孔 |
| 成品板厚(Finish thickness): | 0.70MM |
| 表面处理(Surface finish): | ENIG+OSP |
| 技术亮点(Technical highlights) | 二次激光叠孔，填铜，细线路 |
| 产品应用(Applications): | 高端智能穿戴主板 |
