行业应用

4层载板

层结构(Layer Structure):	4层
最小线宽线距(Min line width/spacing):	50um/50um
最小孔径(Min Via diameter):	0.15mm
成品板厚(Finish thickness):	0.2mm
表面处理(Surface finish):	ENEPIG
技术亮点(Technical highlights)	Resin fill hole
产品应用(Applications):	MEMS