行业应用

10层一阶HDI半孔板

层结构(Layer Structure):	10层1+8+1HDI
最小线宽线距(Min line width/spacing):	75um/75um
最小孔径(Min Via diameter):	0.1mm激光孔/0.25mm机械孔
成品板厚(Finish thickness):	0.8MM
表面处理(Surface finish):	ENIG
技术亮点(Technical highlights)	0.4PITCH BGA夹线
产品应用(Applications):	通信模块