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Products
HDI
Module PCB
HLC PCB
Subtrate
FPC / R&FPC
2/4/6L FPC
Layer Structure
2/4/6层
Min line width/spacing
50um/50um
Min Via diameter
0.1mm
Finish thickness
0.10-0.35mm
Surface finish
ENIG
Technical highlights
Microfine circuit,小孔径,分层
Applications
Cellphone