Home
About us
Products
Application
Capability
News
Contact us
中文
|
EN
Products
HDI
Module PCB
HLC PCB
Subtrate
FPC / R&FPC
18L HLC
Layer Structure
18L HLC
Min line width/spacing
75um/75um
Min Via diameter
0.2mm
Finish thickness
2.4MM
Surface finish
ENIG
Technical highlights
Hi-layer,Hi-TG,Hi-reliability
Applications
Industrial computer