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Products
HDI
Module PCB
HLC PCB
Subtrate
FPC / R&FPC
1+8+1 HDI with Half-moon Via
Layer Structure
1+8+1HDI
Min line width/spacing
75um/75um
Min Via diameter
0.1mm MVH /0.25mm PTH
Finish thickness
0.8MM
Surface finish
ENIG
Technical highlights
0.4PITCH BGA
Applications
Communication Module