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Products
HDI
Module PCB
HLC PCB
Subtrate
FPC / R&FPC
3+4+3 HDI with Gold Finger
Layer Structure
3+4+3HDI
Min line width/spacing
50um/50um
Min Via diameter
0.1mm MVH /0.2mm PTH
Finish thickness
1.0MM
Surface finish
ENIG+OSP
Technical highlights
Hi-TG, 30 micro inch gold finger
Applications
Notebook