| Layer Structure | 2+4+2 HDI |
| Min line width/spacing | 75um/75um |
| Min Via diameter | 0.1mm MVH /0.3mm PTH |
| Finish thickness | 1.0MM |
| Surface finish | ENIG+OSP |
| Technical highlights | Double laser stack, copper filling，Microfine circuit |
| Applications |
High end smart wearable device |
