| Layer Structure | 10L 3+4+3 HDI |
| Min line width/spacing | 50um/50um |
| Min Via diameter | 0.1mm MVH /0.2mm PTH |
| Finish thickness | 0.70MM |
| Surface finish | ENIG+OSP |
| Technical highlights | Triple laser stack, copper filling，Microfine circuit |
| Applications | High end drone |
