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Industry Application
Semiconductor
Internet of Things
Aerospace Industry
Communication Base Stations
Artificial Intelligence
Automotive Electronics
Medical Industrial Control
Smart Terminal
4L R&FPC
Layer Structure
4+1+4
Min line width/spacing
75um/75um
Min Via diameter
0.2mm
Finish thickness
0.1mm (R ) +0.6mm (FPC)
Surface finish
ENIG
Technical highlights
hi-reliability,via fill
Applications
Car
